Dimensity 8400-MAX Flagship Chip Pro at multi-tasking.

Built on TSMC’s advanced 4nm process and an all-big-core flagship architecture, this chipset delivers uncompromising performance.

Enjoy all day, half battery left.

Equipped with advanced silicon anode battery technology, it is compact yet offers massive capacity, with safety features that resist high temperatures and extreme cold.

360° Ultimate Cooling

Built with IceSense Graphene, offering 10x the thermal conductivity of traditional cooling materials, it wraps the phone in 360° efficient heat dissipation.